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PP228201

Devcon HP 250 Epoxy

HP 250 Epoxy, 50 mL, Dev-Pak, Straw
  • Availability: Typically ships in 3-5 days
  • SKU: 230-14415
Availability: Typically ships in 3-5 days
List Price: $0.00
Prices and availability subject to Change
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Adhesives & Glues
Specifications Description

General

Product No.
230-14415
Adhesive Tensile Shear
3
Applicable Materials
Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
Application Temp. Range [Max]
250 F
Application Temp. Range [Min]
-67F
Applications
Multi-Purpose
Base Type
Epoxy
Capacity Vol. [Nom]
400 mL
Chemical Compound
Epoxy
Color
Straw
Dielectric Strength
490 V/mil
Elongation [Nom]
25%
Fix Cure Time @ Temp.
6 h @ 72F
Flash Point [Nom]
200F
Full Cure Time @ Temp.
7 d @ 72 F
Hardness [Nom]
78 Shore D
Material
Thixotropic Paste
Odor/Scent
Low
Packing Type
Cartridge
Physical Form
Paste
Ratio
2:1
Resistance
Chlorinated Solvents; Kerosene; Moisture; Water; Weather
Specific Gravity [Nom]
1.0
Temp. Range [Max]
250 F
Temp. Range [Min]
-67 F
Tensile Strength [Nom]
3
Type
Adhesive
Usage
Structural Bonding
Viscosity [Nom]
Resin: 120
Width [Nom]
400mL
Working Time [Nom]
65 min

Product Description

  • High-performance, gap-filling thixotropic paste for structural bonding applications
  • Superior toughness, impact and chemical resistant
  • Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
  • Excellent gap fill.

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