Devcon HP 250 Epoxy
HP 250 Epoxy, 50 mL, Dev-Pak, Straw
- High-performance, gap-filling thixotropic paste for structural bonding applications
- Superior toughness, impact and chemical resistant
- Bonds metals, FRP/SMC composites, phenolics, stainless steel, aluminum, vinyl esters, nylon, PVC, PC, styrenics, wood, and rigid plastics
- Excellent gap fill.
Devcon HP 250 Epoxy
| Product No. | Adhesive Tensile Shear | Applicable Materials | Applications | Application Temp. Range [Max] | Base Type | Application Temp. Range [Min] | price | Quantity |
|---|---|---|---|---|---|---|---|---|
| 230-14315 | 3 | Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel | Multi-Purpose | Epoxy |
TODAY: $0.00 |
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|
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| 230-14415 | 3 | Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel | Multi-Purpose | 250 F | Epoxy | -67F |
TODAY: $0.00 |
X
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Devcon HP 250 Epoxy
- Adhesive Tensile Shear: 3
- Applicable Materials: Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
- Applications: Multi-Purpose
- Application Temp. Range [Max]:
- Base Type: Epoxy
TODAY: $0.00
- Adhesive Tensile Shear: 3
- Applicable Materials: Aluminum; Brass; Copper; Galvanized Steel; Most Metals; Steel
- Applications: Multi-Purpose
- Application Temp. Range [Max]: 250 F
- Base Type: Epoxy
TODAY: $0.00
